AEC-Q100 8-Layer EV PCB Prototype-High TG 170C Automotive Grade Immersion Gold Surface Finish for VCU BMS Electronic Control

Product Description

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Product Name Network Communication PCB
Number of Layers 14 layers, 7 steps (referring to the layer stack-up configuration)
Board Thickness 0.85mm
Dimensions 130.5*111.6mm
Material Taiyo EM390, 0.05mm (likely referring to the copper clad laminate material with a specific thickness or model number)
Thickness Ratio 1.56:1
Minimum Aperture Through-hole: 0.5mm; Blind via: 0.1mm
Minimum Trace Width/Spacing 40/50μm
Product Features Any-layer interconnection
Surface Treatment Type Immersion Gold (ENIG)
In the realm of high - density interconnect (HDI) printed circuit boards, achieving optimal performance and miniaturization is of paramount importance. Our HDI multilayer PCBs stand out with their advanced design and manufacturing capabilities. These PCBs are constructed with 14 layers, utilizing a sophisticated 7 - step layer stack - up configuration. This intricate stack- up allows for efficient signal routing and power distribution within a compact form factor, meeting the demands of modern electronic devices that require high functionality in limited space.

One of the key features of our HDI PCBs is the precise via technology. We offer through - holes with a diameter of 0.5mm, which provide reliable connections between different layers for standard signal and power transfer. Additionally, the blind vias with a diameter of 0.1mm enable more complex and dense circuit designs. These blind vias can be precisely placed to connect specific layers, facilitating any - layer interconnection. This means that signals can be routed directly between any two layers without being restricted by traditional via placement rules, significantly enhancing the design flexibility and electrical performance of the PCB.

The surface treatment of our HDI PCBs is an Immersion Gold (ENIG) finish. ENIG provides several advantages, including excellent solderability, which ensures reliable component attachment during the assembly process. It also offers good corrosion resistance, protecting the copper traces from environmental factors and extending the service life of the PCB.
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Why choose us

I. Superior Tech, Quality Assured

We lead in PCB manufacturing with advanced processes like high-precision drilling, fine-line fabrication (min. 50μm line width/spacing), and multi-layer lamination, meeting high-end routing density needs for stable signal transmission. A strict quality system ensures over 99.5% yield via flying probe and AOI tests. Our expert R&D team offers tailored solutions, from material selection to complex circuit design.

II. Diverse Products, Versatile Solutions

We provide FR-4, high-frequency, metal-core, and flexible boards, each with unique properties for various applications. Mass-produce 2 - 30 layer PCBs for efficient signal and power management. Customize board size, hole diameter, surface finish, and functions to fit specific scenarios.

III. Timely Delivery, Project Assurance

Optimized production and advanced management shorten cycles. We control delivery for double-sided PCBs within [X] days and arrange multi-layer PCBs flexibly. With large capacity and emergency response, we avoid delays. Real-time tracking keeps clients informed.

IV. Competitive Pricing, High Value

Cost-saving measures enable competitive pricing without compromising quality. Transparent quotes detail all costs. Our PCBs excel in price, quality, and delivery, enhancing clients' product competitiveness.

V. Thoughtful Service, High Satisfaction

Our sales team offers pre-sales expertise. Technical support spans design to production. We handle after-sales issues promptly and conduct follow-ups for continuous improvement.

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Frequently Asked Questions (FAQ)
What are the specifications of the Network Communication PCB?

The Network Communication PCB is a 14-layer board with a thickness of 0.85mm and dimensions of 130.5*111.6mm. It is built using Taiyo EM390 material (0.05mm), featuring a 1.56:1 thickness ratio, a minimum through-hole aperture of 0.5mm, and a minimum trace width/spacing of 40/50μm.

How does any-layer interconnection benefit high-density circuit designs?

By utilizing 0.1mm blind vias, signals can be routed directly between any two layers without being restricted by traditional via placement rules. This greatly increases design flexibility and improves the electrical performance of the PCB within a compact space.

What are the benefits of using an Immersion Gold (ENIG) surface treatment?

Immersion Gold (ENIG) offers excellent solderability, ensuring reliable component attachment during assembly. It also provides robust corrosion resistance, protecting copper traces from environmental factors and extending the board's operational life.

What range of layers and PCB materials can you supply?

We supply 2 to 30 layer PCBs using versatile materials, including standard FR-4, high-frequency, metal-core, and flexible boards, to support different power and signal management requirements.

How do you ensure the quality of manufactured PCBs?

We implement a strict quality control system with advanced testing techniques, including flying probe and Automated Optical Inspection (AOI) tests, maintaining a yield rate of over 99.5%.

What is the typical delivery schedule for PCB projects?

Our optimized production cycles control double-sided PCB deliveries within a standard [X]-day timeframe, while multi-layer PCB production schedules are arranged flexibly based on project requirements to ensure timely delivery.

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